Newtech Electronics

5G and Automotive Electronics Power Third Generation Semiconductor Material Market Expansion

Issuing time:2018-12-27 00:00

Compared with the current mainstream silicon wafer (Si), the third generation semiconductor materials SiC and GaN have the advantages of high temperature resistance and high frequency operation, which can not only greatly reduce the chip area, but also simplify the design of peripheral circuits, so as to reduce the volume of modules, components and cooling systems around the system. In addition to lightening vehicle design, because of the low on-resistance and low switching loss of the third generation semiconductor, the energy conversion loss during vehicle operation can also be greatly reduced, both of which have considerable help to improve the endurance of electric vehicles. Therefore, the technology and market development of SiC and GaN power components are closely related to the development of electric vehicles.

However, SiC materials are still in the validation and introduction stage. At this stage, the automotive field is only used in racing cars. Therefore, at this stage of the world, the area of vehicle power components using SiC solutions is less than one thousandth. On the other hand, GaN power components on the market are made of GaN-on-SiC and GaN-on-Si wafers. GaN-on-SiC has advantages in heat dissipation performance and is quite suitable for high temperature and high frequency operating environment. Therefore, the application visibility of 5G base station is high. It is expected that SiC base plate will enter high speed in the next five years, driven by the verification of the vehicle factory and the commercial use of 5G in 2020. Long-term.

Although the cost of GaN substrates remains high in the process of large-scale area, the output value of GaN substrates is still less than that of SiC substrates. However, the advantage of GaN in high frequency operation is still the focus of attention of major science and technology factories. In addition to high-specification products using GaN-on-SiC technology, GaN-on-Si has become the mainstream market of GaN power components through its cost advantages, and its applications in power management chips and charging systems for automotive and smart phones are growing.

The Tuoqi Institute of Industry pointed out that since 5G and automotive technology are at the center of the industry growth trend, the supply chain has developed wafer OEM mode to provide SiC and GaN OEM services to customers, changing the situation that only Cree, Infineon, Qorvo and other integrated component factories supply in the past. GaN is part of TSMC and the world's leading suppliers of GaN-on-Si, while Steady specializes in the GaN-on-SiC field aiming at 5G base stations. In addition, X-Fab, Hanlei and Universal also provide SiC and GaN's industrial services. With the development of modern industry, the market scale of the third generation semiconductor materials will be further expanded.

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